november 2010 doc id 3503 rev 7 1/10 10 stps1545c power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching avalanche capability specified description dual center tap schottky re ctifier suited for switch mode power supply and high frequency dc to dc converters. packaged either in to-220ab, d 2 pak, i 2 pak, or dpak, this device is especi ally intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. table 1. device summary i f(av) 2 x 7.5 a v rrm 45 v t j (max) 175 c v f (max) 0.57 v a1 a2 k a1 a2 a1 k a2 to-220ab stps1545ct i 2 pak stps1545cr d 2 pak stps1545cg a1 k a2 a1 k a2 dpak stps1545cb www.st.com
characteristics stps1545c 2/10 doc id 3503 rev 7 1 characteristics when the diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.020 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) forward rms current 20 a i f(av) average forward current = 0.5 t c = 157 c per diode 7.5 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 150 a i rrm peak repetitive reverse current t p = 2 s square f = 1 khz 1a i rsm non repetitive peak reverse current t p = 100 s square 2 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 2700 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistances symbol parameter value unit r th(j-c) junction to case per diode to t a l 3.0 1.7 c/w r th(c) coupling 0.35 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r =v rrm - - 100 a t j = 125 c - 5 15 ma v f (1) forward voltage drop t j = 125 c i f = 7.5a - 0.5 0.57 v t j = 25 c i f = 15 a --0.84 t j = 125 c i f = 15 a - 0.65 0.72 d ptot dtj - -------------- 1 rth j a ? () ------------------------- - <
stps1545c characteristics doc id 3503 rev 7 3/10 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 012345678910 0 1 2 3 4 5 6 t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 150 175 0 1 2 3 4 5 6 7 8 9 i (a) f(av) r=r th(j-a) th(j-c) r =15c/w th(j-a) r =40c/w th(j-a) t (c) amb t =tp/t tp figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. relative variation of thermal impedance junction to case versus pulse duration i (a) m 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 i m t =0.5 t(s) t =50c c t =100c c t =150c c 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse
characteristics stps1545c 4/10 doc id 3503 rev 7 figure 11. thermal resistance junction to ambient versus copper surface under tab (dpak) figure 7. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 8. junction capacitance versus reverse voltage applied (typical values, per diode) 0 5 10 15 20 25 30 35 40 45 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 5e+4 i (a) r v (v) r t =125c j t =150c j t =100c j t =25c j t =50c j t =75c j 12 51020 50 100 200 500 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j figure 9. forward voltage drop versus forward current (high values, per diode) figure 10. thermal resistance junction to ambient versus copper surface under tab (d 2 pa k ) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1.0 10.0 100.0 i (a) fm t =125c (typical values) j t =25c maximum values j t =125c maximum values j v (v) fm 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 d2pak epoxy printed circuit board copper thickness = 35 m r (c/w) th(j-a) s (cm2) cu 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 dpak epoxy printed circuit board copper thickness = 35 m r (c/w) th(j-a) s (cm2) cu
stps1545c package information doc id 3503 rev 7 5/10 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. to-220ab dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. dia. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
package information stps1545c 6/10 doc id 3503 rev 7 figure 13. footprint (dimensions in millimeters) table 5. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
stps1545c package information doc id 3503 rev 7 7/10 mounting (soldering) the i 2 pak metal slug (heatsink) with alloy, like a surface mount device, is not permitted. a standard through-hole mounting is mandatory. figure 14. i 2 pak dimensions ref dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 a 4.40 a1 2.49 2.69 0.098 0.106 a1 2.49 b 0.70 0.93 0.028 0.037 b 0.70 b1 1.14 1.17 0.044 0.046 b1 1.14 b2 1.14 1.17 0.044 0.046 b2 1.14 c 0.45 0.60 0.018 0.024 c 0.45 c2 1.23 1.36 0.048 0.054 c2 1.23 d 8.95 9.35 0.352 0.368 d 8.95 e 2.40 2.70 0.094 0.106 e 2.40 e 10.0 10.4 0.394 0.409 e 10.0 l 13.1 13.6 0.516 0.535 l 13.1 l1 3.48 3.78 0.137 0.149 l1 3.48 l2 1.27 1.40 0.050 0.055 l2 1.27 e l2 l1 b1 d a1 c c2 a b e e1 l
package information stps1545c 8/10 doc id 3503 rev 7 figure 15. footprint (dimensions in mm) table 6. dpak dimensions ref. dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
stps1545c ordering information doc id 3503 rev 7 9/10 3 ordering information for the latest information on available order codes see the product pages on www.st.com. 4 revision history table 7. ordering information order code marking package weight base qty delivery mode stps1545ct stps1545ct to-220ab 2.23 g 50 tube stps1545cg stps1545cg d 2 pak 1.48 g 50 tube stps1545cg-tr stps1545cg d 2 pak 1.48 g 1000 tape and reel stps1545cr stps1545cr i 2 pak 1.49 g 50 tube stps1545cb-tr stps1545cb dpak 0.3 g 2500 tape and reel table 8. document revision history date revision changes jul-2003 5f last release. 21-mar-2007 6 removed isowatt and to-220fpab packages. 03-nov-2010 7 added dpak package.
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